Description

At Gigamon, our purpose is to protect the hybrid networks and data of the largest, most complex organizations on the planet. Certified as a Great Place to Work, we offer a deep observability pipeline that efficiently delivers network-derived intelligence to cloud, security, and observability tools. This helps our customers to eliminate security blind spots, optimize network traffic, and dramatically reduce tool cost and complexity, enabling them to better secure and manage their hybrid cloud infrastructure. Gigamon has served more than 4,000 customers worldwide, including over 80 percent of Fortune 100 enterprises, 9 of the 10 largest mobile network providers, and hundreds of governments and educational organizations.

As a Senior PCB Layout Engineer, you will own the physical design and layout of Gigamon’s next-generation, ultra-complex hardware platforms. You will collaborate closely with Hardware, Signal Integrity, Power Integrity, and Mechanical engineering teams to deliver high-density, high-speed designs using Cadence Allegro. In this role, you will architect advanced HDI stackups, solve demanding thermal and power challenges, and ensure robust manufacturability of 16–30 layer boards. Your work will directly enable the performance, reliability, and scalability of Gigamon’s cutting-edge systems.

What you’ll do:

• Architect and optimize 16–30 layer PCB stackups, allocating power, ground, and signal layers to ensure clean return paths, low EMI, and robust signal integrity.

• Execute dense component placement and routing for high-pin-count, fine-pitch BGAs (2000+ pins), silicon interposers, and tight form-factor enclosures.

• Define, embed, and manage complex physical, electrical, and spacing rule sets in Allegro Constraint Manager for ultra-high-speed interfaces such as PCIe Gen5/Gen6, DDR5, and 112G/224G SerDes.

• Implement advanced HDI and via architectures, including blind, buried, and microvias, as well as stacked and staggered via-in-pad solutions.

• Design and optimize Power Delivery Networks across many layers to deliver clean, low-voltage, high-current power to FPGAs, processors, and other power-dense devices.

• Partner with fabrication and assembly vendors in the pre-layout and design phases to align with aspect ratio limits, drill-to-copper tolerances, material constraints, and yield requirements for very high-layer-count designs.

• Perform comprehensive design rule checks (DRC) and generate complete manufacturing data packages, including Gerber, ODB++, IPC-2581, and detailed fabrication and assembly drawings.

What you’ve done:

• Built at least 14 years of dedicated PCB layout experience, including a proven track record taking 16–30 layer HDI boards from concept into volume production.

• Achieved expert-level proficiency with Cadence Allegro PCB Editor (XL/GXL) and Allegro Constraint Manager for high-complexity, high-speed designs.

• Applied deep understanding of signal propagation, transmission line theory, crosstalk mitigation, skin effect, and return path discontinuities at microwave frequencies to real-world layouts.

• Worked extensively with high-performance, low-loss dielectric materials (for example, Megtron 6/7, Tachyon) and sequential lamination processes in collaboration with advanced PCB fabricators.

• Earned a Bachelor’s degree in Electrical Engineering, Computer Engineering, or developed equivalent expertise through substantial industry experience.

• Used MCAD–ECAD co-design flows (IDX or STEP) to coordinate with mechanical engineering on tight mechanical envelopes and 3D clearances.

• Employed basic scripting (such as Tcl, Python, or Cadence SKILL) to automate aspects of placement, routing, checking, or data generation.

• Utilized front-end schematic capture tools such as Cadence OrCAD or Concept HDL in support of PCB layout activities.

Who you are:

• You are a hands-on PCB layout expert who enjoys owning complex designs end-to-end, from concept stackup definition through manufacturing release.

• You think rigorously about high-speed and power integrity physics and translate that understanding into practical constraints, rules, and layout strategies.

• You are highly detail-oriented and systematic, with a strong focus on design quality, manufacturability, and repeatable results at scale.

• You collaborate effectively across Hardware, SI/PI, Mechanical, and manufacturing partners, communicating trade-offs and design rationales clearly.

• You are proactive, self-driven, and comfortable working on challenging, first-of-a-kind designs in a fast-paced technology environment.